Thermal Epoxy Heat Sink

Henkel thermal adhesives create a mechanical attachment of a component to a heat sink with thermal transfer properties and without the need for additional fasteners.

Thermal epoxy heat sink.

The liqui bond product line also offers mild elastic properties which assist in relieving cte mismatches. Serviceable from 4k to 400 f. One part oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. These highly effective thermal interface materials contain special alumina boron nitride silica aluminum nitride fillers or particles to improve device reliability and longevity.

The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications. These thermal tapes provide excellent long term reliability electrical insulation and flame retardant performance. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance.

These customizable liquid tapes pads or a mix means reliable high thermal performance less waste and just in time supply. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. The 70 3812nc aluminum filled epoxy adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds. 3m thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications.

50 3186 nc is a two part thermally conductive epoxy adhesive.