Thermally Conductive Epoxy High Temperature

Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity.

Thermally conductive epoxy high temperature.

Good to 130 c 265 f omegabond 101two part epoxy. Duralco 132 offers the maximum conductivity available in a 500ºf epoxy system. Duralco 132 500 f aluminum filled epoxy. 50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance.

When used as an adhesive the thermally conductive filler has very fine particle sizes. Thermal adhesive tape 20mm by 25m hpfix high performance thermally conductive tape apply for coolers heat sink led strips computer cpu gpu easy to apply high durability 4 4 out of 5 stars 101 12 99 12. Omegabond 100 two part epoxy. Two part room temperature curable epoxy system with high thermal conductivity.

Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity. Thermo bond 100 is designed for the fastest and most continuous high heat transfer. Serviceable from 100 f to 400 f. Sets at room temp.

Resist oils solvents most acids. Aremco bond 805 a new high temperature thermally conductive epoxy system developed by aremco products inc is now for bonding potting and molding applications to 300 ºc 572 ºf. Thermo bond 180 is designed for the fastest and most continuous high heat transfer. Thermally conductive epoxy adhesive black alumina filled casting low exotherm.

Can be supplied as a non sag putty for heat tracing applications. Thermo bond 54 is recommended for high temperature aerospace and electronic applications where the c. Features exceptional thermal conductivity. Serviceable from cryogenic temperatures up to 400 f.

Aluminum metal filled epoxy that cures at room temp to form machinable thermally conductive bond lines. Thermally conductive electrically insulating heat cure epoxy high temperature resistance. Aremco bond 805 is a two component 100 solids aluminum filled epoxy ideal for bonding potting and tooling applications to 300 ºc 572 ºf. This thixotropic adhesive provides high temperature bonds to a variety of substrates.

Master bond ep30tc is a multifaceted epoxy for use in thermal management applications. Very high thermal conductivity. It is a specialty formulation that can be used for bonding coating sealing and encapsulation. Subsequently it can be applied in sections as thin as 5 15 microns.

Sets at room temp. Good to 105 c 221 f omegabond 200 two part epoxy.