Thermal Paste Conductivity Calculation

The thermal conductivity of a material is a measure of its ability to conduct heat it is commonly denoted by or.

Thermal paste conductivity calculation.

I need to calculate thermal resistance of glue layer. Carbon dioxide thermal conductivity online calculator figures and table showing thermal conductivity of carbon dioxide co 2 at temperatures ranging from 50 to 775 c 50 to 1400 f at atmospheric and higher pressure imperial and si units. I found in the manufacturers datasheet is has a thermal conductivity of 1 6w mk watt meter kelvin. This tool generates a quick estimate of the expected junction temperature based on the copper spreading area on the pcb.

Enter the thermal conductivity of your material w m k. Input the cross sectional area m 2 add your materials thickness m enter the hot side temperature c enter the cold side temperature c. But heat sink will be glued using thermal glue like hc910 which has thermal conductivity of 1 7 w m k. The parameters used to calculate thermal conductivity are the steady state temperatures the heat used for the warmer plate and the thickness of the material.

So rglue thickness area k k thermal conductivity. It is very accurate but takes a significant amount of time to. A tube of 8 5w mk carbon based compound which is. I m trying to calculate the thermal paste joint between my pcb and the heatsink.

Whilst all other data i have for the heatsink is in c w. I took 0 1mm as a wild guess. Or select a value from our material database. You can see that the thermal compound is actually a poor heat conductor and that is exactly the reason why you only need a very thin layer of paste to fill the micro imperfections between.

The heat transfer conduction calculator below is simple to use. How does the heat transfer conduction calculator works. For example the thermal conductivity of a high grade thermal paste is 8 5 w mk and the heat conductivity of copper is 385 w mk or for aluminum 205 w mk. The pcb thermal calculator helps you estimate the junction temperatures of components which use exposed pad packages.

Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices. Convective heat transfer heat transfer between a solid and a moving fluid is called. I my case area is 0 01m 0 009m 0 0000054 sq m k is 1 7 and i have no clue what thickness will be.